Thrilled to announce that Avnet ASIC Israel is partnering with Bar-Ilan University to establish an Advanced Chiplet Innovation Center, scheduled to open in 2026.
The partnership brings together our expertise in ASIC design, physical implementation, and advanced packaging with Bar-Ilan University’s Enics Institute, a leading academic research group in advanced semiconductor architecture and R&D.
Located within our facility, the center will focus on developing next-generation 2.5D and 3D integration solutions based on TSMC’s advanced technology nodes, tailored to the rapidly growing European ASIC market. 

Read more- Advanced Chiplet Innovation Centre to open in 2026