Chiplet based architectures and advanced packaging enable scalable, efficient semiconductor integration through modular design, standardization, and high-performance die-to-die interfaces.

Download Chipex2025_Chiplet_Advanced_Packaging- By Pavel Vilk

Shift to chiplet based semiconductor integration, enabling modular , high performance and scalable solutions through advanced packaging and collaborative innovation between Avnet ASIC and Bar-Ilan University.

Download TSMC_OIP_Bar_Ilan_2025- Chiplet Era - By Pavel Vilk

Synopsys- Showcasing power efficient implementation flow with Synopsys tools and characterization

Download Power Efficient Implementation Flow- By Ron Blum

ChipEx- Introducing a comprehensive approach to implement an ultra-low power blockchain application through innovative physical design techniques in TSMC 4nm technology

Download ChipEx2024 Tailor-Made for Efficiency- By Ron Blum