At Avnet ASIC (AAS), we deliver industry leading Packaging Solutions designed to accelerate your product’s performance, reliability, and time to market. Leveraging strategic partnerships with ASE, Amkor, and UTAC, we provide extensive engineering support, engineering studies, and a proven approach to advanced packaging technologies. Our long standing experience ensures customers benefit from production proven solutions across high volume and next generation semiconductor programs. 

We have in house package design and SI PI simulation team. 
AAS supports the spectrum of packaging needs- From high volume mass production to highly specialized, advanced packaging solutions.

Typical Packaging for Mass Production
We offer a wide portfolio of mainstream production ready packages, including: BGA, FC and WB, LGA, Exposed LGA, Cu Pillar, QFN, a-QFN, QFP, WLCSP,  optional with heat slug.
Designed for robust manufacturability and scalability, these package options support a diverse range of performance and form factor requirements.

Specialized Packaging for Complex Architectures
For customers developing cutting edge technologies, AAS delivers advanced packaging capabilities that enable higher integration and better electrical performance.
Special Packaging Options: 2.5D packaging, Interposer based packaging (CoWoS), SiP (Sbs or Stuck), Transparent packaging, Ceramics.

Package Related Services
AAS complements its packaging portfolio with a robust suite of advanced engineering services: Package design, Thermal simulation, Power simulation, Parasitic extraction, Package Qualification.